What is the optimal encapsulation technology for the Flexible AMOLED?
Currently mass-producing flexible AMOLED panels are taking PI substrate, backplane, and RGB deposition method, and the existing encapsulation technologies for A2 line of Samsung Display is TFE (thin film encapsulation) and hybrid encapsulation for LG Display.
But for the flexible AMOLED exclusive A3 line which is newly invested by the Samsung Display, advanced the orders not in the TFE but in the hybrid encapsulation method which is laminating the film after resin coating process on the passivation structure of inorganic layer and organic layer, similar to the method that the LG Display takes.
The reason for the change of encapsulation technology at the A3 of Samsung Display was analyzed in the “2014 Flexible OLED Report” issued by the UBI Research including the latest trends and issues such as the flexible AMOLED related issues and processes, market forecast of the flexible AMOLED panel and flexible OLED lighting, flexible AMOLED technologies comparison of Samsung Display and LG Display, etc.
According to this report, the flexible AMOLED panel market is forecasted to show a compound annual growth rate of about 60% through to 2020, reaching $ 17,600 million where the primary applications are expected to be for the flexible AMOLED panel of tablet pc.
<Flexible AMOLED panel Market Forecast>
